Realme X9 Pro with Dimensity 1200 5G SoC, 108MP camera to be launched soon

Realme on Wednesday confirmed that it will be one of the first smartphone brands to release a flagship equipped with MediaTek’s latest generation of 5G chipset: Dimensity 1200.

Now, GSMArena has reported that Realme X9 Pro will be the company’s new flagship that will be equipped with Dimensity’s new flagship 5G smartphone chip. The 5G Dimensity 1200 mobile platform is based on the advanced 6nm manufacturing process and is claimed to offer premium camera features, graphics and connectivity enhancements.

“Building on the complete improvement of the Dimensity 1200 in 5G, AI, photography, video and gaming, the realme flagship smartphone will offer users an all-round superior 5G experience,” Realme said in a post on the community forum.

Citing a trusted source, GSMArena said the newly launched Dimensity 1200 5G SoC will be paired with up to 12GB of LPDDR5 RAM and up to 256GB of onboard storage.

Realme X9 Pro is rumored to feature a 6.4-inch OLED display with a 120Hz refresh rate and triple rear camera setup that includes a 108MP primary sensor and a pair of 13MP lenses, probably the ultra wide angle lens and the telephoto lens.

Additionally, the device will be equipped with a 4,500mAh battery which will support 65W fast charging and will run on Android 11 with the Realme UI 2.0 skin on top.

News Highlights:

  • Now, GSMArena has reported that Realme X9 Pro will be the company’s new flagship that will be equipped with Dimensity’s new flagship 5G smartphone chip. The 5G Dimensity 1200 mobile platform is based on the advanced 6nm manufacturing process and is claimed to offer premium camera features, graphics and connectivity enhancements.
  • Realme X9 Pro with Dimensity 1200 5G SoC, 108MP camera to be launched soon